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  1. 1. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Författare :Markus Dernevik; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Sammanfattning : .... LÄS MER

  3. 2. Polysaccharide-based wood adhesives

    Författare :Tijana Todorovic; Eva Malmström; Linda Fogelström; Johannes Konnerth; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fiber- och polymervetenskap; Fibre and Polymer Science;

    Sammanfattning : It is highly desirable to increase the use of renewable resources and reduce fossil-dependence due to sustainability concerns. As a consequence, it is expected that the use of the wood-based materials will increase in the future. Therefore, adhesives will have an important role since they allow for the use of lower-quality and recycled wood. LÄS MER

  4. 3. Hemicellulose-based wood adhesives

    Författare :Tijana Todorovic; Eva Malmström; Linda Fogelström; Francisco Vilaplana; Magdalena Sterley; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fiber- och polymervetenskap; Fibre and Polymer Science;

    Sammanfattning : The increasing sustainability concern encourages the society to use sustainable resources. In the wood industry the main component is from a renewable resource, but others are not. One of the fossil-based components is the adhesive. LÄS MER

  5. 4. Kraft lignin in phenol formaldehyde resin

    Författare :Birgitta Danielson; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; phenol formaldehyde resin; lignin phenol based adhesives; plywood manufacturing; kraft lignin; adhesives;

    Sammanfattning : .... LÄS MER

  7. 5. Electrically Induced Debonding of Adhesives

    Författare :Simon Leijonmarck; Göran Lindbergh; Mats Johansson; Jinshan Pan; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Chemical engineering; Kemiteknik;

    Sammanfattning : Electrically induced adhesive debonding is a process where an adhesive can be debonded at command with help of an applied voltage. To make this process function, the adhesive is  bonded between two metal substrates. In this study an epoxy adhesive is adhered between two aluminium foils forming a laminate structure. LÄS MER