Sökning: "System-on-Package SoP"

Hittade 3 avhandlingar innehållade orden System-on-Package SoP.

  1. 1. System-on-package solutions for multi-band RF front end

    Författare :Xinzhong Duo; Li-Rong Zheng; Kari Halonen; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; chip-package co-design; multi-band radio; system-on-package; Electronic structure; Elektronstruktur;

    Sammanfattning : Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. LÄS MER

  3. 2. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

    Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

    Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER

  4. 3. Concurrent chip and package design for radio and mixed-signal systems

    Författare :Meigen Shen; Li-Rong Zheng; Shaofang Gong; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik;

    Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER