Sökning: "Solder"

Visar resultat 1 - 5 av 24 avhandlingar innehållade ordet Solder.

1. 1. Solder Matrix Fiber Composite Thermal Interface Materials

   Författare :Josef Hansson; Chalmers tekniska högskola; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal management; composite materials; solder; thermal interface material;

   Sammanfattning : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. LÄS MER

3. 2. Exploration of Metal Composites and Carbon Nanotubes for Thermal Interfaces

   Författare :Josef Hansson; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; Solder; Thermal interface materials; Carbon nanotubes;

   Sammanfattning : Modern microelectronics are perpetually pushing against limitations caused by inadequate heat dissipation. One of the critical bottlenecks is at the interfaces between different materials and components. LÄS MER

4. 3. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; heat dissipation; electronic packaging; nanomaterial; characterization; thermal interface material; solder; thermoelectric.; interconnect; through silicon via;

   Sammanfattning : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. LÄS MER

5. 4. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

   Författare :Sun Peng; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

   Sammanfattning : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. LÄS MER

7. 5. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

   Sammanfattning : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. LÄS MER