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  1. 1. Point Defects in Silicon and Silicon-Carbide

    Författare :Paolo Pellegrino; KTH; []
    Nyckelord :silicon; silicon carbide; defects; dlts;

    Sammanfattning : .... LÄS MER

  3. 2. Silicon micromachining : methodological aspects and applications in biomedical pressure sensors

    Författare :Ylva Bäcklund; Uppsala universitet; []
    Nyckelord :NATURAL SCIENCES; NATURVETENSKAP;

    Sammanfattning : .... LÄS MER

  4. 3. Silicon microstructures : fabrication techniques and applications

    Författare :Leif Smith; Uppsala universitet; []
    Nyckelord :NATURAL SCIENCES; NATURVETENSKAP;

    Sammanfattning : .... LÄS MER

  5. 4. Silicon nanowires, nanopillars and quantum dots : Fabrication and characterization

    Författare :Robert Juhasz; Jan Linnros; Philippe M. Fauchet; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Silicon nanowires; silicon nanopillars; silicon quantum dots; size-reduction; thermal oxidation; electrochemical etching of silicon; photoluminescence; Semiconductor physics; Halvledarfysik;

    Sammanfattning : Semiconductor nanotechnology is today a very well studied subject, and demonstrations of possible applications and concepts are abundant. However, well-controlled mass-fabrication on the nanoscale is still a great challenge, and the lack of nanofabrication methods that provide the combination of required fabrication precision and high throughput, limits the large-scale use of nanodevices. LÄS MER

  7. 5. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing

    Författare :Markus Forsberg; Jörgen Olsson; Jyrki Molarius; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; chemical mechanical polishing; chemical mechanical planarization; silicon; silicon dioxide; front end; shallow trench isolation; deep trench isolation; bipolar transistor; BiCMOS; wafer bonding; Elektronik; Electronics; Elektronik;

    Sammanfattning : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. LÄS MER