Sökning: "Silicon Micromachining"

Visar resultat 21 - 25 av 33 avhandlingar innehållade orden Silicon Micromachining.

  1. 21. Novel RF MEMS Switch and Packaging Concepts

    Författare :Joachim Oberhammer; KTH; []
    Nyckelord :0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER

  3. 22. Novel RF MEMS Devices for W-Band Beam-Steering Front-Ends

    Författare :Nutapong Somjit; Joachim Oberhammer; Pierre Blondy; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : This thesis presents novel millimeter-wave microelectromechanical-systems (MEMS) components for W-band reconfigurable beam-steering front-ends. The proposed MEMS components are novel monocrystalline-silicon dielectric-block phase shifters, and substrate-integrated three-dimensional (3D) micromachined helical antennas designed for the nominal frequency of 75 GHz. LÄS MER

  4. 23. Advanced MEMS Technology for Terahertz Frequencies

    Författare :Zhao Xinghai; Joachim Oberhammer; Umer Shah; Oleksandr Glubokov; Jan Stake; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : With the development of terahertz (THz) technology, a variety of application demands are growing rapidly, such as high-rate communications, THz radars, environmental monitoring, medical imaging, and space exploration. However, the fabrication, integration, and packaging techniques for THz components and systems pose great challenges for a large-scale, cost-effective production. LÄS MER

  5. 24. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  7. 25. Valve-less diffuser micropumps

    Författare :Anders Olsson; KTH; []
    Nyckelord :;

    Sammanfattning : Today there is growing interest in research on microfluidicsystems, e.g., for chemical analysis systems and microdosagesystems. One of the basic components in microfluidic systems ismicropumps. LÄS MER