Sökning: "Shen Li"

Hittade 3 avhandlingar innehållade orden Shen Li.

  1. 1. Advanced Optical Diagnostics in Particle Combustion for Biomass and Metal as Alternative Fuels

    Författare :Shen Li; Förbränningsfysik; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical diagnostics; Quantitative measurement; Iron powder; Biomass; High-speed imaging; Digital holography; 3D reconstruction; SEM; Fysicumarkivet A:2022:Li;

    Sammanfattning : The energy sector is in urgent need for carbon-free strategies considering environmental pollutions and climate change impact. Two kinds of solid fuels, biomass and metal particles have been studied in this thesis aiming at CO2 emission reduction or zero carbon emission. LÄS MER

  3. 2. Rapid sintering of ceramics by intense thermal radiation

    Författare :Duan Li; Zhijian Shen; Lutz-Michael Berger; Stockholms universitet; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Sintering; sintering by intense thermal radiation; spark plasma sintering; heat transfer; mass transfer; scattering; coalescence; densification; grain growth; numerical simulation; porous ceramic; foaming; nanostructure; hierarchical heterogeneities; permeability; Materials Chemistry; materialkemi;

    Sammanfattning : Sintering is an important processing step for obtaining the necessary mechanical stability and rigidity of ceramic bulk materials. Both mass and heat transfer are essential in the sintering process. The importance of radiation heat transfer is significantly enhanced at high temperatures according to the well-known Stefan-Boltzmann’s law. LÄS MER

  4. 3. Concurrent chip and package design for radio and mixed-signal systems

    Författare :Meigen Shen; Li-Rong Zheng; Shaofang Gong; KTH; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik;

    Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER