Sökning: "Planar integrated circuit"
Visar resultat 6 - 10 av 17 avhandlingar innehållade orden Planar integrated circuit.
6. Wafer-level processing of ultralow-loss Si3N4
Sammanfattning : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. LÄS MER
7. Design, Fabrication and Characterization of Planar Lightwave Circuits Based on Silicon Nanowire Platform
Sammanfattning : Optical devices based on Planar Lightwave Circuit (PLC) technology have well been studied due to their inherited advantages from Integrated Circuits (IC), such as: small size, high reliability, mass production and potential integration with microelectronics. Among all the materials, silicon nanowire platform gains more and more interest. LÄS MER
8. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER
9. Vertical III-V/High-k Nanowire MOS Capacitors and Transistors
Sammanfattning : The emerging nanowire technology in recent years has attracted an increasing interest for high-speed, low-power electronics due to the possibility of a gate-all-around (GAA) geometry enabling aggressive gate length scaling, together with the ease in incorporating high-mobility narrow band gap III-V semiconductors such as InAs on Si substrates. These benefits make vertical nanowire transistors an attractive alternative to the planar devices. LÄS MER
10. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER