Sökning: "Packaging"
Visar resultat 16 - 20 av 420 avhandlingar innehållade ordet Packaging.
16. Integration and Packaging Concepts for Infrared Bolometer Arrays
Sammanfattning : Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. LÄS MER
17. Elucidating the Influence of Food Packaging Attributes on Source-separation of Food Packaging Waste at Home
Sammanfattning : The global amount of waste generated by households, including food packaging waste, has been increasing continuously across the world, posing a massive threat to societies and the environment. Proper waste management, therefore, has become a challenging environmental issue and a priority for governments. LÄS MER
18. The Leader of the Pack : A Service Perspective on Packaging and Customer Satisfaction
Sammanfattning : Almost everything we as consumers buy in a store has a package. Packages have many functions – some, if not all, present marketers with the opportunity to gain competitive advantages. LÄS MER
19. Making packaging more sustainable: Effects of resource embeddedness
Sammanfattning : Firms involved in e-commerce distribution are faced with challenges due to the increasing volume of single shipments to consumers, including concerns regarding sustainability. For instance, the role of packaging has gained increased attention because of over-packed parcels and excessive air within those parcels, which frustrate retailers, logistics service providers, and consumers. LÄS MER
20. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications
Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER