Sökning: "Packaging deformation"

Visar resultat 1 - 5 av 16 avhandlingar innehållade orden Packaging deformation.

  1. 1. Getting to grips with cartons : Interactions of carbonboard packages with an artificial finger

    Författare :Daniel Eriksson; Christer Korin; Sören Östlund; Örebro universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Cartonboard packaging; Packaging mechanics; Packaging deformation; Manual handling;

    Sammanfattning : Packaging is an important part of most products in our modern world. It produces waste, but it also enables products to reach consumers safely and efficiently. Hence, the proper design of packaging is becoming increasingly important. Historically, cartonboard packages were designed for box compression strength. LÄS MER

  3. 2. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

    Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

    Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER

  4. 3. Impact of paperboard deformation and damage mechanisms on packaging performance

    Författare :Gustav Marin; Sören Östlund; Mikael Nygårds; Tomasz Garbowski; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Solid Mechanics; Hållfasthetslära;

    Sammanfattning : Paper-based materials, such as paperboard, are commonly used as packaging materials. In addition to the fact that paper is renewable, there are also many other benefits of paperboard. LÄS MER

  5. 4. Micro-mechanically based modeling of mechano-sorptive creep in paper

    Författare :Johan Alfthan; Peter Gudmundson; Staffan Toll; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; applied mechanics; materials science; packaging; Materialvetenskap; Materials science; Teknisk materialvetenskap;

    Sammanfattning : The creep of paper is accelerated by moisture content changes. This acceleration is known as mechano-sorptive creep, which is also found in wood and some other materials. Mechano-sorptive creep has been known for several decades but it is still not well understood, and there is no generally accepted model explaining the effect. LÄS MER

  7. 5. Mechanical Behaviour of Adhesive Joints in Cartonboard for Packaging

    Författare :Christer Korin; Magnus Lestelius; Nils Hallbäck; Christophe Barbier; Christer Fellers; Karlstads universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Hot melt Adhesives; Carton board; Y-peel; Peel strength; Chemical Engineering; Kemiteknik;

    Sammanfattning : A cartonboard package is often sealed and closed with an adhesive – either a hot-melt adhesive (adhesives that are applied in a molten state on the cartonboard) or a dispersion adhesive (adhesives that are applied as water-based dispersions). This thesis focuses on the process of hot-melt gluing, and how material properties and process conditions affect the performance of the adhesive joint. LÄS MER