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Visar resultat 1 - 5 av 26 avhandlingar som matchar ovanstående sökkriterier.

1. 1. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

   Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

   Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

3. 2. Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining

   Författare :Umer Shah; Joachim Oberhammer; Raafat Mansour; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectromechanical systems; MEMS; Radio frequency microelectromechanical systems; RF MEMS; Micromachined transmission line; Micromachining; Tuneable capacitor; Switched capacitor; Coupled-line coupler; Tuneable directional coupler; Intermodulation distortion; MEMS varactor; Two-tone IIP3 measurement; Passive components and circuits; Reliability; Magnetic materials; NiFe multilayer composite; Permeability; Permittivity; Micromachined inductors;

   Sammanfattning : This thesis presents novel radio frequency microelectromechanical (RF MEMS) circuits based on the three-dimensional (3-D) micromachined coplanar transmission lines whose geometry is re-configured by integrated microelectromechanical actuators. Two types of novel RF MEMS devices are proposed. LÄS MER

4. 3. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

   Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

   Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER

5. 4. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

   Författare :Niklaus Frank; KTH; []
   Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

   Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

7. 5. Fluidic Microsystems for Micropropulsion Applications in Space

   Författare :Johan Bejhed; Johan Köhler; Anders Eriksson; Greger Thornell; Thomas Laurell; Uppsala universitet; []
   Nyckelord :Engineering physics; microelectromechanical systems; MEMS; MST; microsystem; microfluidics; silicon; spacecraft; propulsion; space technology; Teknisk fysik;

   Sammanfattning : Spacecraft on interplanetary missions or advanced satellites orbiting the Earth all require propulsion systems to complete their missions. Introducing microelectromechanical systems technology to the space industry will not only reduce size and weight of the propulsion system, but can also increase the performance of the mission. LÄS MER