Sökning: "Micro-electromechanical systems MEMS"

Visar resultat 1 - 5 av 10 avhandlingar innehållade orden Micro-electromechanical systems MEMS.

1. 1. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

   Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

   Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER

3. 2. Integration of graphene into MEMS and NEMS for sensing applications

   Författare :Xuge Fan; Frank Niklaus; Peter Steeneken; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; Nano-electromechanical systems NEMS ; heterogeneous 3D integration; Graphene; single-layer graphene; double-layer graphene; bilayer graphene; chemical vapor deposition CVD ; suspended graphene beams; suspended graphene membranes; doubly clamped; fully clamped; silicon on insulator SOI ; vapor hydrofluoric acid VHF ; Young’s modulus; built-in stress; built-in tension; piezoresistivity; gauge factor; accelerometer; resonators; electromechanical sensing; advanced transducers; humidity; gas sensing; sensitivity; CO2 sensing; graphene grain boundary; line defects; optical microscopy; wire bonding; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : This thesis presents a novel approach to integrate chemical vapor deposition (CVD) graphene into silicon micro- and nanoelectromechanical systems (MEMS/NEMS) to fabricate different graphene based MEMS/NEMS structures and explore mechanical properties of graphene as well as their applications such as acceleration sensing, humidity sensing and CO2 sensing. The thesis also presents a novel method of characterization of CVD graphene grain boundary based defects. LÄS MER

4. 3. MM-wave integrated RF-MEMS tunable cavity resonators, filters and ultra-low phase-noise oscillators

   Författare :Dragos Dancila; Isabelle Huynen; Universite catholique de Louvain (UCL); []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : Within the Microelectronics Industry, the core research is focused on the realization of the Moore's law, which states that circuit density doubles every 24 months, shaping the framework of the More of Moore paradigm. However, Moore's law is expected to end, as devices are reaching limitations inherent to the approach of the atomical dimensions. LÄS MER

5. 4. Advancing portable, aqueous drug delivery to the human lung

   Författare :Torben Last; Göran Stemme; Niclas Roxhed; Claus-Michael Lehr; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Portable Inhaler; Biopharmaceuticals; Soft-mist inhaler; Transport vesicles; Microfluidic packaging; High-pressure microfluidics; aerosolization; cleanroom-free fabrication; drug delivery; micro-electromechanical systems MEMS ; Applied Medical Technology; Tillämpad medicinsk teknik;

   Sammanfattning : Lung disease profoundly impacts human health: many lung diseases are currently without cure and require continued treatment. Due to their ease of use and integration into the daily routine, portable inhalers are the preferred treatment option for patients. LÄS MER

7. 5. Towards Unconventional Applications of Wire Bonding

   Författare :Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. LÄS MER