Sökning: "Mechanical manufacturing engineering"
Visar resultat 21 - 25 av 994 avhandlingar innehållade orden Mechanical manufacturing engineering.
21. Aerodynamic design framework for low-pressure compression systems
Sammanfattning : Aircraft engine manufacturers strive to improve current state of the art designs through continuous development efforts. By improving existing designs and exploring new alternatives, the goal is to reduce the fuel consumption - a topic of high relevance due to the remarkable growth rate of air traffc. LÄS MER
22. Light-weighting Methodology in Rail Vehicle Design through Introduction of Load Carrying Sandwich Panels
Sammanfattning : Lightweight design in rail vehicles has been important for quite some time. Structures have been optimised to fulfill their purpose and cut unnecessary weight to reach allowable axle loads. Classically this is done by using steel, thin-walled structures, throughout the car body, or, alternatively, power-pressed aluminum profiles. LÄS MER
23. On the Design of Functionally Integrated Aero-engine Structures: Modeling and Evaluation Methods for Architecture and Complexity
Sammanfattning : The drive for airplanes with radically reduced fuel consumption and emissions motivates engine manufacturers to explore innovative engine designs. The novelty of such engines results in changed operating conditions, such as newly introduced constraints, increased loads or rearranged interfaces. LÄS MER
24. The Concept of Mobile Manufacturing
Sammanfattning : There is a need for a manufacturing concept that is characterized by ease in changing between manufacturing places, ease in producing wherever it is convenient for the moment, ease in collaborating with different partners, and reconfigurability and reuse of manufacturing capacity, while at the same time keeping control of the own capabilities. The objective of this thesis is to investigate and describe the concept of mobile manufacturing in order to find new ways of competing for the manufacturing industry. LÄS MER
25. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER