Sökning: "Electronics and Electrical technology"

Visar resultat 6 - 10 av 703 avhandlingar innehållade orden Electronics and Electrical technology.

  1. 6. Synthesis and Characterization of ZnO/Graphene Nanostructures for Electronics and Photocatalysis

    Författare :Seyed Ebrahim Chalangar; Håkan Pettersson; Magnus Willander; Omer Nur; Christian Falconi; Linköpings universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; zinc oxide; graphene; nanostructure; nanocomposite; conjugated electronics; photocatalysis; nanofabrication; colloidal lithography; chemical bath deposition; sol-gel;

    Sammanfattning : Recent rapid development of electronics and electro-optical devices demands affordable and reliable materials with enhanced performance. Forming nanocomposites of already well-known materials is one possible route towards novel functional materials with desirable synergistic enhanced properties. LÄS MER

  3. 7. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Författare :Shuangxi Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER

  4. 8. VCSEL Cavity Engineering for High Speed Modulation and Silicon Photonics Integration

    Författare :Emanuel Haglund; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; high-speed modulation; on-chip laser source; vertical-cavity surface-emitting laser VCSEL ; semiconductor lasers; optical interconnects; large signal modulation; laser dynamics; heterogeneous integration; vertical-cavity silicon-integrated laser VCSIL ; silicon photonics;

    Sammanfattning : The GaAs-based vertical-cavity surface-emitting laser (VCSEL) is the standard light source in today's optical interconnects, due to its energy efficiency, low cost, and high speed already at low drive currents. The latest commercial VCSELs operate at data rates of up to 28 Gb/s, but it is expected that higher speeds will be required in the near future. LÄS MER

  5. 9. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Författare :Xin Luo; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Sammanfattning : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER

  7. 10. Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering

    Författare :Thomas Öhlund; Håkan Olin; Hans-Erik Nilsson; Mattias Andersson; Patrick Gane; Mittuniversitetet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; inkjet printing; silver nanoparticles; paper; flexible substrates; sintering; printed electronics; IPL sintering; flash sintering; copper films; coatings; thin films; AgNP; conductive films; metal films;

    Sammanfattning : A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. LÄS MER