Sökning: "Chemical plating"

Hittade 4 avhandlingar innehållade orden Chemical plating.

  1. 1. Electrocatalytic properties of Ni hydroxides with Zn or Co in the Ni matrix

    Författare :Gert Göransson; Göteborgs universitet.; Gothenburg University.; [2014]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; Redoxmediated prcesses; pulse plated NiZn; carbon paste electrodes; RRDE; DEMS; XAFS;

    Sammanfattning : The majority of the work in this thesis has been made with the improvement of the systems for electrochemical co-generation of chemicals and electricity in mind. This is an appealing but challenging way of producing chemicals with energy as a bi-product, and is commonly referred to as “green chemistry”. LÄS MER

  2. 2. Development of Techniques to Produce Nickel Coated Composite Materials as well as Hollow Nickel Fibres and Kinetic Study of the Process Involved

    Detta är en avhandling från Stockholm : KTH

    Författare :Fan Li; KTH.; [2007]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nickel; Chemical plating; Kinetics; Model; Hollow nickel fibres; Thermal decomposition; TECHNOLOGY Materials science; TEKNIKVETENSKAP Teknisk materialvetenskap;

    Sammanfattning : The present thesis was mainly to study the preparation of nickel composite materials by chemical plating process. Nickel coated boron nitride particles, nickel coated spherical silica particles and nickel viscose composite fibres were prepared. Both experiment and model development were carried out to study the kinetics of the processes. LÄS MER

  3. 3. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Detta är en avhandling från Stockholm : KTH

    Författare :Liu Chen; [2005]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER

  4. 4. Electrodeposition of Ag/Co and Au/Co compositionally modulated thin films and nanowire arrays

    Detta är en avhandling från Linköping : Linköpings universitet

    Författare :Sima Valizadeh; Linköpings universitet.; Linköpings universitet.; [2001]

    Sammanfattning : In the past decade, electrochemical synthesis of metallic nanowires within the pores of porous membranes have attracted considerable attention because of their special optical, electronic, and magnetic properties as well as potential for nanotechnological applications. The concept of using membranes as a template for fabrication of metallic nanowires by electrodeposition is considered as an alternative solution to overcome the difficulty of fabricating fibrils with very small diameters by lithographic methods. LÄS MER