Sökning: "Application package"

Visar resultat 21 - 25 av 69 avhandlingar innehållade orden Application package.

  1. 21. Environmental Life-cycle Assessment in Microelectronics Packaging

    Författare :Anders Andrae; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; System-In-a-Package; microelectronics packaging; data collection; attributional environmental life-cycle assessment; uncertainty analysis; upstream processes; consequential life-cycle assessment; environmental life-cycle inventory; microelectronic products;

    Sammanfattning : An increased understanding of the application of environmental Life-Cycle Assessment (LCA) methodologies in the microelectronics packaging area should help in developing environmentally sound product systems. The aim of the present thesis is to increase the knowledge of using LCA tools, methods and models, in application to current and new microelectronic products. LÄS MER

  3. 22. Test Cost Reduction of 3D Stacked ICs : Test Planning and Test Flow Selection

    Författare :Breeta Sengupta; Integrerade elektroniksystem; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; 3D Stacked Integrated Circuits 3D SIC ; Test Cost; Optimization; Test Flow; Design for Test DfT ; Test Application Time TAT ;

    Sammanfattning : Ever higher levels of integration within the Integrated Circuit (IC) tomeet progressively widening scope of its application in respect of functionality,size, performance and manufacturing issues inspired developmentof the three-dimensional (3D) Stacked IC as a device havingviable architecture. However, with increased complexity, manufacturingcost increased. LÄS MER

  4. 23. Methods and Tools for Co-Simulation of Dynamic Systems with the Functional Mock-up Interface

    Författare :Christian Andersson; Matematik LTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Coupled Systems; Co-Simulation; FMI; Functional Mock-up Interface; PyFMI; Assimulo; Stability; Master Algorithm;

    Sammanfattning : Simulation of coupled dynamical systems, where the subsystems are bundled with their own internal solver, is important in industry. This is due to that in many cases, with complex systems, this is the only viable option. LÄS MER

  5. 24. Fracture Behaviour of adhesive Joints in carton board

    Författare :Christer Korin; Gunnar Engström; Erik Serrano; Karlstads universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Chemical engineering; Kemiteknik; Chemical Engineering; Kemiteknik;

    Sammanfattning : A carton-board package is often sealed and closed with an adhesive. Package requirements vary depending on how the package is to be used. A package that is only supposed to protect the product during transport differs from one that is supposed to attract consumers and facilitate the use of the product by consumers. LÄS MER

  7. 25. Mechanical Behaviour of Adhesive Joints in Cartonboard for Packaging

    Författare :Christer Korin; Magnus Lestelius; Nils Hallbäck; Christophe Barbier; Christer Fellers; Karlstads universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Hot melt Adhesives; Carton board; Y-peel; Peel strength; Chemical Engineering; Kemiteknik;

    Sammanfattning : A cartonboard package is often sealed and closed with an adhesive – either a hot-melt adhesive (adhesives that are applied in a molten state on the cartonboard) or a dispersion adhesive (adhesives that are applied as water-based dispersions). This thesis focuses on the process of hot-melt gluing, and how material properties and process conditions affect the performance of the adhesive joint. LÄS MER