Sökning: "Application package"

Visar resultat 1 - 5 av 49 avhandlingar innehållade orden Application package.

  1. 1. Mechanics and Failure in Thin Material Layers Towards Realistic Package Opening Simulations

    Detta är en avhandling från Karlskrona : Blekinge Tekniska Högskola

    Författare :Eskil Andreasson; Sharon Kao-Walter; Gabriella Bolzon; [2019]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; aluminium foil; FEM; LDPE; localisation; necking; polymer; progressive damage; semi-crystalline; simulation; virtual twin;

    Sammanfattning : The final goal of this PhD-work is an efficient and user-friendly finite element modelling strategy targeting an industrial available package opening application.  In order to reach this goal, different experimental mechanical and fracture mechanical tests were continuously refined to characterize the studied materials. LÄS MER

  2. 2. Anskaffning av standardsystem för att utveckla verksamheter - Utveckling och prövning av SIV-metoden : Acquisition of Application Packages for Developing Business Activities - Development and Validation of the SIV method

    Detta är en avhandling från Stockholm : EFI, Handelshögskolan i Stockholm

    Författare :Anders G. Nilsson; [1991]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Information Management; standardsystem application package ; programpaket packaged software ; anskaffning software acquisition ; verksamhet business activities ; systemutveckling systems development ; metodik methodology ; Information Systems; Informatik;

    Sammanfattning : Anskaffning av programvara kan ses som en möjlighet att utveckla ett företag och dess affärsverksamhet. Det finns idag ett stort utbud av standardiserade programvaror att välja emellan. Sådana produkter brukar i dagligt tal kallas för standardsystem. LÄS MER

  3. 3. The development and implementation of software for palaeoenvironmental and palaeoclimatological research the Bugs Coleopteran Ecology Package (BugsCEP)

    Detta är en avhandling från Umeå : Arkeologi och samiska studier

    Författare :Philip Buckland; Roger Engelmark; Geoffrey Lemdahl; Paul Sinclair; [2007]
    Nyckelord :HUMANIORA; HUMANITIES; Quaternary geology; environmental archaeology; quaternary science; Coleoptera; beetles; database; environmental reconstructions; climate reconstructions; software; Mutual Climatic Range; MCR; palaeoentomology; Kvartärgeologi; HUMANITIES and RELIGION History and philosophy subjects Archaeology subjects Archaeology; HUMANIORA och RELIGIONSVETENSKAP Historisk-filosofiska ämnen Arkeologiämnen Arkeologi; Archaeology; arkeologi;

    Sammanfattning : This thesis documents the development and application of a unique database orientated software package, BugsCEP, for environmental and climatic reconstruction from fossil beetle (Coleoptera) assemblages. The software tools are described, and the incorporated statistical methods discussed and evaluated with respect to both published modern and fossil data, as well as the author’s own investigations. LÄS MER

  4. 4. Intelligent and Interactive Package Based on RFID and WSN

    Detta är en avhandling från Stockholm : KTH Royal Institute of Technology

    Författare :Jie Gao; Li-Rong Zheng; Richard Uusijärvi; [2011]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning :    An intelligent and interactive package can interact with people smartly, safely and friendly. It involves many technologies such as electronics, optics, biologic, magnetics and electro-mechanics. LÄS MER

  5. 5. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Detta är en avhandling från Stockholm : KTH Royal Institute of Technology

    Författare :Liu Chen; [2005]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER