Sökning: "3D stacked IC 3DSIC test"

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  1. 1. Thermal Issues in Testing of Advanced Systems on Chip

    Författare :Nima Aghaee Ghaleshahi; Zebo Peng; Petru Eles; Jaan Raik; Linköpings universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SoC test; test scheduling; Adaptive test; Temperature awareness; Process variation; Thermal simulation; 3D stacked IC 3DSIC test; Burn-in; Temperature gradients; Temperature Cycling Test; Test Ordering;

    Sammanfattning : Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. LÄS MER