Sökning: "340 GHz"
Visar resultat 1 - 5 av 9 avhandlingar innehållade orden 340 GHz.
1. Millimeter and Sub-Millimeter Wave Integrated Active Frequency Down-Converters
Sammanfattning : In recent years, the increasing amount of data transmission, the need for automotiveradars, and standoff imaging for security applications are the main factors that accelerateresearch in the millimeter and sub-millimeter wave frequency ranges. The semiconductorindustries have continuously developed their processes, which have opened upopportunities for manufacturing monolithically integrated circuits up to a few hundredGHz, based on transistor technologies. LÄS MER
2. Submillimeter-Wave Waveguide Frontends by Silicon-on-Insulator Micromachining
Sammanfattning : This thesis presents novel radiofrequency (RF) frontend components in the submillimeter-wave (sub-mmW) range implemented by silicon micromachining, or deep reactive ion etching (DRIE). DRIE is rapidly becoming a driving technology for the fabrication of waveguide components and systems when approaching the terahertz (THz) frequency range. LÄS MER
3. Photonic THz Generation and Quasioptical Integration for Imaging Applications
Sammanfattning : This thesis deals with the analysis and optimisation of the uni-travelling-carrier photodiode (UTC-PD) for continuous-wave generation in terahertz (THz) frequencyrange. Photonic THz generation using UTC-PDs is extremely promising as it offers wide tunability, adequate output power and room temperature operation. LÄS MER
4. Millimetre wave waveguide enclosed grid frequency multipliers and imaging
Sammanfattning : The utilisation of the THz spectrum ( 0.3-10 THz ) is hampered by fundamental difficulties in generating power at these frequencies. LÄS MER
5. Advanced Schottky Diode Receiver Front-Ends for Terahertz Applications
Sammanfattning : This thesis treats the development of high frequency circuits for increased functionality of terahertz receiver front-ends based on room temperature Schottky diode technology. This includes the study of novel circuit integration schemes, packaging concepts as well as new measurement and characterisation techniques. LÄS MER