Sökning: "3-dimension"
Hittade 2 avhandlingar innehållade ordet 3-dimension.
1. 3-D Characterization and Degradation Analysis of Rock aggregates
Sammanfattning : .... LÄS MER
2. Concurrent chip and package design for radio and mixed-signal systems
Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER
Resultatsidor:
1