Sökning: "wafer"

Visar resultat 1 - 5 av 138 avhandlingar innehållade ordet wafer.

  1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Författare :Niklaus Frank; KTH; []
    Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

  3. 2. Wafer-level heterogeneous integration of MEMS actuators

    Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  4. 3. Wafer Bonding - Problems and Possibilities

    Författare :Mats Bergh; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SOI; atomic force microscope; micromechanics; compliant substrates; wafer bonding; semi-insulating silicon; AFM; surface chemistry; diamond; silicon on insulator; aluminium nitride; microelectronics; surface roughness;

    Sammanfattning : The wafer bonding technology offers a unique opportunity to combine different materials. This has been used for the realisation of novel silicon on insulator (SOI) structures. By replacing the buried silicon dioxide layer with a polycrystalline diamond film the thermal properties of the SOI structure are improved. LÄS MER

  5. 4. Wafer Bonding for Spaceflight Applications : Processing and Characterisation

    Författare :Kerstin Jonsson; Maaike Visser-Taklo; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; Engineering physics; Teknisk fysik;

    Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER

  7. 5. Oxygen plasma assisted silicon wafer bonding

    Författare :Petra Amirfeiz; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; surface energy; diffusion; water; porous silica; oxygen plasma; wafer bonding;

    Sammanfattning : .... LÄS MER