Sökning: "switch array"

Visar resultat 1 - 5 av 34 avhandlingar innehållade orden switch array.

  1. 1. Wafer-level heterogeneous integration of MEMS actuators

    Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  3. 2. Submillimeter-Wave Waveguide Frontends by Silicon-on-Insulator Micromachining

    Författare :Adrian Gomez-Torrent; Joachim Oberhammer; Umer Shah; Goutam Chattopadhyay; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; antenna; orthomode transducer; switch; waveguide; radiofrequency; beamforming network; submillimeter-wave; terahertz; silicon micromachining; deep reactive ion etching; silicon on insulator; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : This thesis presents novel radiofrequency (RF) frontend components in the submillimeter-wave (sub-mmW) range implemented by silicon micromachining, or deep reactive ion etching (DRIE). DRIE is rapidly becoming a driving technology for the fabrication of waveguide components and systems when approaching the terahertz (THz) frequency range. LÄS MER

  4. 3. On millimeter and submillimeter wave focal plane arrays implemented with MEMS waveguide switches

    Författare :Henrik Frid; Joachim Oberhammer; Vessen Vassilev; Mikro- och nanosystemteknik KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Extended Hemispherical Lens; Beam Steering; Focal Plane Array FPA ; Ray-Tracing; RF MEMS; waveguide switch; micromachined waveguide; submillimeter-wave; rectangular waveguide; terahertz; lenses; antenna theory; silicon; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : This thesis presents research towards enabling micromachined millimeter and submillimeter wave focal plane arrays (FPAs). The FPAs operate under the following principle: a switch network consisting of microelectromechanical (MEMS) switches, integrated with micromachined waveguides, is used to feed an array of antenna elements, located in the focal plane of a high-gain quasi-optical system. LÄS MER

  5. 4. Gene expression in the dorsal root ganglion and the role of PAI-1 and amphiregulin during regeneration

    Författare :Anna Nilsson; Biologiska institutionen; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Neurology; neuropsychology; neurophysiology; Neurologi; neuropsykologi; neurofysiologi; Djurfysiologi; Animal physiology; DRG; micro-array; peripheral nerve regeneration; mouse;

    Sammanfattning : This thesis is concerned with two aspects of peripheral nerve injury. First the early changes in the gene expression of the dorsal root ganglion (DRG) in response to sciatic nerve injury as revealed by micro-array analysis. Second an examination of the effect of PAI-1 and amphiregulin on survival and axonal outgrowth from DRG. LÄS MER

  7. 5. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER