Sökning: "soldering"

Visar resultat 1 - 5 av 13 avhandlingar innehållade ordet soldering.

  1. 1. Alternative electronic packaging concepts for high frequency electronics

    Författare :Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

    Sammanfattning : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. LÄS MER

  3. 2. Flip chip for high frequency applications : materials aspects

    Författare :Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

    Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER

  4. 3. Environmental Life-cycle Assessment in Microelectronics Packaging

    Författare :Anders Andrae; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; System-In-a-Package; microelectronics packaging; data collection; attributional environmental life-cycle assessment; uncertainty analysis; upstream processes; consequential life-cycle assessment; environmental life-cycle inventory; microelectronic products;

    Sammanfattning : An increased understanding of the application of environmental Life-Cycle Assessment (LCA) methodologies in the microelectronics packaging area should help in developing environmentally sound product systems. The aim of the present thesis is to increase the knowledge of using LCA tools, methods and models, in application to current and new microelectronic products. LÄS MER

  5. 4. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Författare :Peng Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Sammanfattning : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. LÄS MER

  7. 5. Manufacture and characterization of elastic interconnection microstructures in silicone elastomer

    Författare :Slavko Dejanovic; Sture Petersson; Johan Liu; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicone elastomer; packaging; assembly; elastic interconnection; chip socket; metallization; RIE of silicone elastomer; Electrophysics; Elektrofysik;

    Sammanfattning : The subject of this thesis is a new chip to substrate interconnection technique using self-aligning elastic chip sockets. This work was focused on the technology steps which are necessary to fulfill in order to realize the suggested technique. LÄS MER