Sökning: "package design"

Visar resultat 21 - 25 av 129 avhandlingar innehållade orden package design.

  1. 21. Design, analysis and integration of mixed-signal systems for signal and power integrity

    Författare :Li-Rong Zheng; KTH; []
    Nyckelord :signal integrity; power distribution; interconnects; deep submicron circuits; system-on-chip; system-in-package; mixed signalsystem; single level integration;

    Sammanfattning : .... LÄS MER

  3. 22. Design and implementation of RF system-on package modules for short-range wireless communicaions

    Författare :Xinzhong Duo; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Computer and systems science; Data- och systemvetenskap;

    Sammanfattning : .... LÄS MER

  4. 23. A transformational approach to formal digital system design

    Författare :Mats Larsson; Linköpings universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES;

    Sammanfattning : The continuing development in electronic technology has made it possible to fit more and more functionality on a single chip, thus allowing digital systems to become increasingly complex. This has led to a need for better synthesis and verification methods and tools to manage this complexity.Formal digital system design is one such method. LÄS MER

  5. 24. Intelligent and Interactive Package Based on RFID and WSN

    Författare :Jie Gao; Li-Rong Zheng; Richard Uusijärvi; KTH; []
    Nyckelord :;

    Sammanfattning :    An intelligent and interactive package can interact with people smartly, safely and friendly. It involves many technologies such as electronics, optics, biologic, magnetics and electro-mechanics. LÄS MER

  7. 25. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER