Sökning: "large area panel processing"
Hittade 4 avhandlingar innehållade orden large area panel processing.
1. High frequency electronic packaging and components : characterization, simulation, materials and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. LÄS MER
2. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER
3. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging
Sammanfattning : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. LÄS MER
4. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER