Sökning: "interconnect"

Visar resultat 1 - 5 av 133 avhandlingar innehållade ordet interconnect.

1. 1. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

   Författare :Li-Han Hsu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

   Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER

3. 2. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; heat dissipation; electronic packaging; nanomaterial; characterization; thermal interface material; solder; thermoelectric.; interconnect; through silicon via;

   Sammanfattning : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. LÄS MER

4. 3. Carbon Nanotube Based Interconnect Material for Electronic Applications

   Författare :Di Jiang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrical interconnect; bump; densification; electronics packaging; carbon nanotube; three dimensional integration; flexible electronics; through silicon via; transfer;

   Sammanfattning : Carbon nanotubes (CNTs) are considered as a candidate material for future electronicinterconnect applications. This thesis summarizes the research work on thefabrication and characterization of CNT-based interconnect systems, and exploresthe possibilities of integrating CNTs into various electronic interconnect scenarios. LÄS MER

5. 4. Design, Processing, and Characterization of High Frequency Flip Chip Interconnects

   Författare :Wei-Cheng Wu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; coaxial; microwave; interconnect; transition; high frequency; microstrip; coplanar waveguide; flip chip; hot-via; packaging;

   Sammanfattning : The demands for high frequency interconnect techniques for microwave integrated circuits (ICs) are growing with increasing operating frequencies of wireless communication systems. Interconnects have significant effect and impact on the overall system performance at high frequencies. LÄS MER

7. 5. Coated Ferritic Stainless Steels as Interconnects in Solid Oxide Fuel Cells

   Författare :Jan Gustav Grolig; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Stainless Steel; Interconnect; SOFC; Chromium volatilization;

   Sammanfattning : Solid oxide fuel cells (SOFCs) have gained increased research interest as they arepromising devices for a decentralized and clean electricity and heat production. Severalmaterial challenges have to be solved to reach sufficient efficiencies and life times. LÄS MER