Sökning: "Silver resistance"

Visar resultat 1 - 5 av 18 avhandlingar innehållade orden Silver resistance.

  1. 1. Aspects of Bacterial Resistance to Silver

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Susanne Sütterlin; Uppsala universitet.; [2015]
    Nyckelord :MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; Antimicrobial resistance; Silver resistance; Klinisk bakteriologi; Clinical Bacteriology;

    Sammanfattning : Bacterial resistance to antibiotics has increased rapidly within recent years, and it has become a serious threat to public health. Infections caused by multi-drug resistant bacteria entail higher morbidity, mortality, and a burden to health care systems. LÄS MER

  2. 2. Copper and Silver Metallization for High Temperature Applications

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Shabnam Mardani; Uppsala universitet.; [2016]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Metallization; Copper; Silver; Tantalum; High tempreture; Diffussion; Electromigration; Stability;

    Sammanfattning : High-temperature electrical- and morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG) semiconductors. In this context, the thermal stability of both Ag and Cu films with Ta and TaN films as diffusion barriers and/or surface-capping layers at high temperatures up to 800 oC is investigated in this thesis. LÄS MER

  3. 3. Mercury-induced autoimmunity Genetics and immunoregulation

    Detta är en avhandling från Stockholm : Wenner-Grens institut för experimentell biologi

    Författare :Monika Hansson; Stockholms universitet.; [2004]
    Nyckelord :MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; mercury; autoimmunity; collagen-induced arthritis; Th1 Th2; silver; tight-skin 1 mice; MEDICINE Microbiology; immunology; infectious diseases Immunology; MEDICIN Mikrobiologi; immunologi; infektionssjukdomar Immunologi;

    Sammanfattning : The existence of immune self-tolerance allows the immune system to mount responses against infectious agents, but not against self-molecular constitutes. Although self-tolerance is a robust phenomenon, in some individuals as well as in experimental models, the self-tolerance breaks down and as a result, a self-destructive autoimmune disease emerges. LÄS MER

  4. 4. Survival of infectious agents and detection of their resistance and virulence factors

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Eva Tano; Uppsala universitet.; [2015]
    Nyckelord :MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; Transportation system; swab; polymicrobial samples; Neisseria gonorrhoeae; bacteremia; exotoxins; Staphylococcus aureus; TSST-1; silver; silver resistance; wound dressing; sil genes; laundry; tumble drying; bacterial decontamination;

    Sammanfattning : In the first study, three different transport systems for bacteria were evaluated. The CLSI M40-A guideline was used to monitor the maintenance of both mono- and polymicrobial samples during a simulated transportation at room temperature that lasted 0-48 h. LÄS MER

  5. 5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Detta är en avhandling från Chalmers University of Technology

    Författare :Shuangxi Sun; Chalmers tekniska högskola.; Chalmers University of Technology.; [2017]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; VA-CNT-Cu; 3D IC integration; TIM; graphene; thermal resistance; TSV; VA-CNT-Solder; electrical resistivity; G-CNT; VA-CNTs;

    Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER