Sökning: "Schottky diodes"
Visar resultat 1 - 5 av 50 avhandlingar innehållade orden Schottky diodes.
1. Modelling of Terahertz Planar Schottky Diodes
Sammanfattning : This thesis deals with the modelling of THz planar Schottky diodes, focusing on analyses of the geometry- dependent parasitics and the diode chip thermal management. Moving towards higher operating frequencies, the electromagnetic couplings pose significant limitations on the diode performance. LÄS MER
2. On Gate Drivers for MOS-Controlled Power Devices and dv-dt Filters for Train Traction Converters
Sammanfattning : In this thesis, low-loss gate-drive solutions and a proposed dv/dt-filter have been investigated with focus on train traction converters with dv/dt constraints.By using the silicon carbide (SiC) junction field-effect transistor (JFET), the switching losses can be significantly reduced compared to the commonly used insulated-gate bipolar transistor (IGBT), but complex gate-driver solutions are required for high utilization in terms of loss reduction. LÄS MER
3. Design, Processing and Characterization of Silicon Carbide Diodes
Sammanfattning : Electronic power devices made of silicon carbide promisesuperior performance over today's silicon devices due toinherent material properties. As a result of the material'swide band gap of 3. LÄS MER
4. Design and characterisation of terahertz Schottky diode harmonic mixers
Sammanfattning : Efficient, compact, and reliable terahertz frequency converters preferably operating at ambient temperature are crucial for stabilising far-infrared optical sources. This thesis focuses on the design and characterisation of terahertz Schottky diode harmonic mixers for frequency stabilisation of quantum-cascade lasers. LÄS MER
5. Advanced Schottky Diode Receiver Front-Ends for Terahertz Applications
Sammanfattning : This thesis treats the development of high frequency circuits for increased functionality of terahertz receiver front-ends based on room temperature Schottky diode technology. This includes the study of novel circuit integration schemes, packaging concepts as well as new measurement and characterisation techniques. LÄS MER